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Solidification microstructure in a supercooled binary alloy

Hongfu Wang

Hongfu Wang

School of Mechanical Engineering, North University of ChinaTaiyuan, China
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Wang, Hongfu
, 
Cheng Tang

Cheng Tang

School of Mechanical Engineering, North University of ChinaTaiyuan, China
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Tang, Cheng
, 
Hongen An

Hongen An

Faculty of Engineering, University Malaysia SabahKota Kinabalu, Malaysia
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An, Hongen
 and 
Yuhong Zhao

Yuhong Zhao

College of Materials Science and Engineering, North University of ChinaTaiyuan, China
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Zhao, Yuhong
  
Dec 18, 2021
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Published Online: Dec 18, 2021
Page range: 383 - 394
Received: Jun 18, 2021
Accepted: Oct 11, 2021
DOI: https://doi.org/10.2478/msp-2021-0031
Keywords
© 2021 Hongfu Wang et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Language:
English
Publication timeframe:
4 times per year
Journal Subjects:
Materials Sciences, Materials Sciences, other, Nanomaterials, Functional and Smart Materials, Materials Characterization and Properties
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