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Solidification microstructure in a supercooled binary alloy

Hongfu Wang

Hongfu Wang

School of Mechanical Engineering, North University of ChinaTaiyuan, China
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Wang, Hongfu
, 
Cheng Tang

Cheng Tang

School of Mechanical Engineering, North University of ChinaTaiyuan, China
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Tang, Cheng
, 
Hongen An

Hongen An

Faculty of Engineering, University Malaysia SabahKota Kinabalu, Malaysia
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An, Hongen
 and 
Yuhong Zhao

Yuhong Zhao

College of Materials Science and Engineering, North University of ChinaTaiyuan, China
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Zhao, Yuhong
  
Dec 18, 2021
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Published Online: Dec 18, 2021
Page range: 383 - 394
Received: Jun 18, 2021
Accepted: Oct 11, 2021
DOI: https://doi.org/10.2478/msp-2021-0031
Keywords
© 2021 Hongfu Wang et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Wang, Hongfu
School of Mechanical Engineering, North University of ChinaTaiyuan, China
Tang, Cheng
School of Mechanical Engineering, North University of ChinaTaiyuan, China
An, Hongen
Faculty of Engineering, University Malaysia SabahKota Kinabalu, Malaysia
Zhao, Yuhong
College of Materials Science and Engineering, North University of ChinaTaiyuan, China
Language:
English
Publication timeframe:
4 times per year
Journal Subjects:
Materials Sciences, Materials Sciences, other, Nanomaterials, Functional and Smart Materials, Materials Characterization and Properties
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