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Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy

S.N. Alam

S.N. Alam

Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
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Alam, S.N.
, 
N. Jindal

N. Jindal

Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
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Jindal, N.
 and 
N. Naithani

N. Naithani

Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
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Naithani, N.
  
Aug 02, 2019
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Published Online: Aug 02, 2019
Page range: 212 - 224
Received: Apr 13, 2018
Accepted: Jul 18, 2018
DOI: https://doi.org/10.2478/msp-2019-0032
Keywords
© 2019 S.N. Alam et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.
Language:
English
Publication timeframe:
4 times per year
Journal Subjects:
Materials Sciences, Materials Sciences, other, Nanomaterials, Functional and Smart Materials, Materials Characterization and Properties
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