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Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy

S.N. Alam

S.N. Alam

Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
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Alam, S.N.
, 
N. Jindal

N. Jindal

Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
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Jindal, N.
 and 
N. Naithani

N. Naithani

Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
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Naithani, N.
  
Aug 02, 2019
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Published Online: Aug 02, 2019
Page range: 212 - 224
Received: Apr 13, 2018
Accepted: Jul 18, 2018
DOI: https://doi.org/10.2478/msp-2019-0032
Keywords
© 2019 S.N. Alam et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.
Alam, S.N.
Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
Jindal, N.
Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
Naithani, N.
Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
Language:
English
Publication timeframe:
4 times per year
Journal Subjects:
Materials Sciences, Materials Sciences, other, Nanomaterials, Functional and Smart Materials, Materials Characterization and Properties
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