Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations

Data publikacji: 11 lip 2015

Zakres stron: 445 - 450

Otrzymano: 30 sty 2014

Przyjęty: 27 lut 2015

DOI: https://doi.org/10.1515/msp-2015-0054

Słowa kluczowe

thermal interface material (TIM), molecular dynamics simulations (MD), diffusivity, intermetallic compound (IMC)

© 2015

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.