Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations

Publicado en línea: 11 jul 2015

Páginas: 445 - 450

Recibido: 30 ene 2014

Aceptado: 27 feb 2015

DOI: https://doi.org/10.1515/msp-2015-0054

Palabras clave

thermal interface material (TIM), molecular dynamics simulations (MD), diffusivity, intermetallic compound (IMC)

© 2015

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.