Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations

Online veröffentlicht: 11. Juli 2015

Seitenbereich: 445 - 450

Eingereicht: 30. Jan. 2014

Akzeptiert: 27. Feb. 2015

DOI: https://doi.org/10.1515/msp-2015-0054

Schlüsselwörter

thermal interface material (TIM), molecular dynamics simulations (MD), diffusivity, intermetallic compound (IMC)

© 2015

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.