Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations

Publié en ligne: 11 juil. 2015

Pages: 445 - 450

Reçu: 30 janv. 2014

Accepté: 27 févr. 2015

DOI: https://doi.org/10.1515/msp-2015-0054

Mots clés

thermal interface material (TIM), molecular dynamics simulations (MD), diffusivity, intermetallic compound (IMC)

© 2015

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.