Otwarty dostęp

Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes


Zacytuj

Gurleen Dhillon
Electronics and Communication Engineering Department Thapar Institute of Engineering and Technology Patiala, Punjab, India
Karmjit Singh Sandha
Electronics and Communication Engineering Department Thapar Institute of Engineering and Technology Patiala, Punjab, India
eISSN:
1339-309X
Język:
Angielski
Częstotliwość wydawania:
6 razy w roku
Dziedziny czasopisma:
Engineering, Introductions and Overviews, other