Accesso libero

Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes

INFORMAZIONI SU QUESTO ARTICOLO

Cita

Gurleen Dhillon
Electronics and Communication Engineering Department Thapar Institute of Engineering and Technology Patiala, Punjab, India
Karmjit Singh Sandha
Electronics and Communication Engineering Department Thapar Institute of Engineering and Technology Patiala, Punjab, India
eISSN:
1339-309X
Lingua:
Inglese
Frequenza di pubblicazione:
6 volte all'anno
Argomenti della rivista:
Engineering, Introductions and Overviews, other