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Journals
Journal of Electrical Engineering
Volume 74 (2023): Issue 1 (February 2023)
Open Access
Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes
Gurleen Dhillon
Gurleen Dhillon
and
Karmjit Singh Sandha
Karmjit Singh Sandha
| Mar 07, 2023
Journal of Electrical Engineering
Volume 74 (2023): Issue 1 (February 2023)
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Article Category:
PAPERS
Published Online:
Mar 07, 2023
Page range:
57 - 63
Received:
Jan 21, 2023
DOI:
https://doi.org/10.2478/jee-2023-0007
Keywords
carbon nanotube (CNT)
,
single-walled CNT (SWCNT)
,
multi-walled CNT (MWCNT)
,
double-walled CNT (DWCNT)
,
multi-walled and double-wall CNT bundles (MDCB)
,
multi-walled and single-wall CNT bundles (MSCB)
,
power-delay product (PDP)
,
mean-free path (MFP)
© 2023 Gurleen Dhillon et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Gurleen Dhillon
Electronics and Communication Engineering Department Thapar Institute of Engineering and Technology
Patiala, Punjab, India
Karmjit Singh Sandha
Electronics and Communication Engineering Department Thapar Institute of Engineering and Technology
Patiala, Punjab, India