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Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes


Cite

Gurleen Dhillon
Electronics and Communication Engineering Department Thapar Institute of Engineering and Technology Patiala, Punjab, India
Karmjit Singh Sandha
Electronics and Communication Engineering Department Thapar Institute of Engineering and Technology Patiala, Punjab, India
eISSN:
1339-309X
Idioma:
Inglés
Calendario de la edición:
6 veces al año
Temas de la revista:
Engineering, Introductions and Overviews, other