<abstract xmlns="http://www.w3.org/1999/xhtml">

<p>This paper presents modeling of high current capability of mixed carbon nanotube (CNT) bundle interconnects depending upon the type of constituent CNT materials and their orientations. With different arrangements, one category of novel mixed CNT bundles formed by the combination of multi-walled/multi-shell CNT and double-shell CNT bundles (MDCB) are proposed and compared with the mixed CNT bundles (MSCB) formed with multi-shell CNT and single-walled CNT bundles. A time-domain analysis is performed for these structures to analyse the effect of delay and power dissipation. It has also been observed that MDCB structures give better performance (≈ 30%) than MSCB structures in terms of power-delay product at the global length of interconnect for nano-regime technology nodes. Also, MDCB structure formed by placing multi-walled CNTs along the periphery and double-walled CNTs in the centre of structure yields the best result against all proposed mixed CNT bundled structures and can be employed for future interconnect applications.</p>
</abstract>

This paper presents modeling of high current capability of mixed carbon nanotube (CNT) bundle interconnects depending upon the type of constituent CNT materials and their orientations. With different arrangements, one category of novel mixed CNT bundles formed by the combination of multi-walled/multi-shell CNT and double-shell CNT bundles (MDCB) are proposed and compared with the mixed CNT bundles (MSCB) formed with multi-shell CNT and single-walled CNT bundles. A time-domain analysis is performed for these structures to analyse the effect of delay and power dissipation. It has also been observed that MDCB structures give better performance (≈ 30%) than MSCB structures in terms of power-delay product at the global length of interconnect for nano-regime technology nodes. Also, MDCB structure formed by placing multi-walled CNTs along the periphery and double-walled CNTs in the centre of structure yields the best result against all proposed mixed CNT bundled structures and can be employed for future interconnect applications.

Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes

Journal of Electrical Engineering

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

This paper presents modeling of high current capability of mixed carbon nanotube (CNT) bundle interconnects depending upon the type of constituent CNT...

Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes

Article Category: PAPERS

Online veröffentlicht: 07. März 2023

Seitenbereich: 57 - 63

Eingereicht: 21. Jan. 2023

DOI: https://doi.org/10.2478/jee-2023-0007

Schlüsselwörter
carbon nanotube (CNT), single-walled CNT (SWCNT), multi-walled CNT (MWCNT), double-walled CNT (DWCNT), multi-walled and double-wall CNT bundles (MDCB), multi-walled and single-wall CNT bundles (MSCB), power-delay product (PDP), mean-free path (MFP)

© 2023 Gurleen Dhillon et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes

Article Category: PAPERS

Online veröffentlicht: 07. März 2023

Seitenbereich: 57 - 63

Eingereicht: 21. Jan. 2023

DOI: https://doi.org/10.2478/jee-2023-0007

Schlüsselwörtercarbon nanotube (CNT), single-walled CNT (SWCNT), multi-walled CNT (MWCNT), double-walled CNT (DWCNT), multi-walled and double-wall CNT bundles (MDCB), multi-walled and single-wall CNT bundles (MSCB), power-delay product (PDP), mean-free path (MFP)

© 2023 Gurleen Dhillon et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Schlüsselwörter
carbon nanotube (CNT), single-walled CNT (SWCNT), multi-walled CNT (MWCNT), double-walled CNT (DWCNT), multi-walled and double-wall CNT bundles (MDCB), multi-walled and single-wall CNT bundles (MSCB), power-delay product (PDP), mean-free path (MFP)