<abstract xmlns="http://www.w3.org/1999/xhtml"><p>This work presents the investigations of AlN thin films deposited on Si substrates by means of magnetron sputtering. Nine different sputtering processes were performed. Based on obtained results, the tenth process was prepared and performed (for future ISFET structures manufacturing). Round aluminum (Al) electrodes were evaporated on the top of deposited layers. The MIS capacitor structures enabled a subsequent electrical characterization of the AlN films by means of current-voltage (I-V) and capacitance-voltage (C-V) measurements. Based on these results, the main parameters of investigated layers were obtained. Moreover, the paper describes the technology of fabrication and electrical characterization of ISFET transistors and possibility of their application as ion sensors.</p></abstract>

This work presents the investigations of AlN thin films deposited on Si substrates by means of magnetron sputtering. Nine different sputtering processes were performed. Based on obtained results, the tenth process was prepared and performed (for future ISFET structures manufacturing). Round aluminum (Al) electrodes were evaporated on the top of deposited layers. The MIS capacitor structures enabled a subsequent electrical characterization of the AlN films by means of current-voltage (I-V) and capacitance-voltage (C-V) measurements. Based on these results, the main parameters of investigated layers were obtained. Moreover, the paper describes the technology of fabrication and electrical characterization of ISFET transistors and possibility of their application as ion sensors.

Properties of AlN thin films deposited by means of magnetron sputtering for ISFET applications

Materials Science-Poland

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

This work presents the investigations of AlN thin films deposited on Si substrates by means of magnetron sputtering. Nine different sputtering processes were...

Properties of AlN thin films deposited by means of magnetron sputtering for ISFET applications

Data publikacji: 06 sty 2016

Zakres stron: 669 - 676

Otrzymano: 13 sty 2014

Przyjęty: 16 cze 2015

DOI: https://doi.org/10.1515/msp-2015-0095

Słowa kluczowe
ISFET/MISFET technology, AlN, aluminum nitride, magnetron sputtering

© 2015 Piotr Firek et al., published by De Gruyter Open

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Properties of AlN thin films deposited by means of magnetron sputtering for ISFET applications

Data publikacji: 06 sty 2016

Zakres stron: 669 - 676

Otrzymano: 13 sty 2014

Przyjęty: 16 cze 2015

DOI: https://doi.org/10.1515/msp-2015-0095

Słowa kluczoweISFET/MISFET technology, AlN, aluminum nitride, magnetron sputtering

© 2015 Piotr Firek et al., published by De Gruyter Open

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Słowa kluczowe
ISFET/MISFET technology, AlN, aluminum nitride, magnetron sputtering