<abstract xmlns="http://www.w3.org/1999/xhtml"><p>The present work reports the effect of Cu addition on the melting point, hardness and electrical resistivity of Sn-57 wt.% Bi eutectic solder alloy. Both binary eutectic Sn-57 wt.% Bi and ternary Sn-(57-x)Bi-xCu (x = 0.1, 0.3, 0.5, 0.7 and 1 wt.%) alloys containing various amounts of Cu were developed by melting casting route. The microstructure of the various solder alloys was analyzed using an optical microscope and a SEM. The variation in melting point, hardness and electrical resistivity of the Sn-Bi eutectic solder alloys with the addition of Cu was determined. The melting point of the eutectic Sn-Bi solder alloy was found to decrease up to the addition of 0.7 wt.% Cu. However, further addition of Cu led to an increase in the melting point of the alloy. Addition of Cu led to an increase in the hardness of the eutectic Sn-Bi solder alloy whereas the electrical resistivity of this alloy was found to increase up to the addition of 0.7 wt.% of Cu beyond which a decrease in the electrical resistivity was observed. A change in the microstructure of the solder alloy was observed when it was reheated above the melting temperature.</p></abstract>

The present work reports the effect of Cu addition on the melting point, hardness and electrical resistivity of Sn-57 wt.% Bi eutectic solder alloy. Both binary eutectic Sn-57 wt.% Bi and ternary Sn-(57-x)Bi-xCu (x = 0.1, 0.3, 0.5, 0.7 and 1 wt.%) alloys containing various amounts of Cu were developed by melting casting route. The microstructure of the various solder alloys was analyzed using an optical microscope and a SEM. The variation in melting point, hardness and electrical resistivity of the Sn-Bi eutectic solder alloys with the addition of Cu was determined. The melting point of the eutectic Sn-Bi solder alloy was found to decrease up to the addition of 0.7 wt.% Cu. However, further addition of Cu led to an increase in the melting point of the alloy. Addition of Cu led to an increase in the hardness of the eutectic Sn-Bi solder alloy whereas the electrical resistivity of this alloy was found to increase up to the addition of 0.7 wt.% of Cu beyond which a decrease in the electrical resistivity was observed. A change in the microstructure of the solder alloy was observed when it was reheated above the melting temperature.

Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy

Department of Metallurgical and Material Engineering

Materials Science-Poland

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

{"article-title":"Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy"}

The present work reports the effect of Cu addition on the melting point, hardness and electrical resistivity of Sn-57 wt.% Bi eutectic solder alloy. Both...

Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy

Online veröffentlicht: 02. Aug. 2019

Seitenbereich: 212 - 224

Eingereicht: 13. Apr. 2018

Akzeptiert: 18. Juli 2018

DOI: https://doi.org/10.2478/msp-2019-0032

Schlüsselwörter
Sn-Bi-Cu, lead-free solder alloys, melting point, DSC/TGA

© 2019 S.N. Alam et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy

Online veröffentlicht: 02. Aug. 2019

Seitenbereich: 212 - 224

Eingereicht: 13. Apr. 2018

Akzeptiert: 18. Juli 2018

DOI: https://doi.org/10.2478/msp-2019-0032

SchlüsselwörterSn-Bi-Cu, lead-free solder alloys, melting point, DSC/TGA

© 2019 S.N. Alam et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Schlüsselwörter
Sn-Bi-Cu, lead-free solder alloys, melting point, DSC/TGA