<abstract xmlns="http://www.w3.org/1999/xhtml"><p>The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive discussion was presented on two major area of mechanical properties and microstructural investigation of SAC305 and SAC405. In this chapter, we study the composition, mechanical properties of SAC solder alloys and microstructure were examined by optical microscope and SEM and mechanical properties such as tensile tests, hardness test and density test of the lead solder alloys were explored. SAC305 and SAC405 alloys with different Ag content and constant Cu content under investigation and compare the value of SAC305 and SAC405. From this investigation, it was reported that tensile strength is increased, with an increase of Ag content and hardness and density were also increases in the same manner.</p></abstract>

The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive discussion was presented on two major area of mechanical properties and microstructural investigation of SAC305 and SAC405. In this chapter, we study the composition, mechanical properties of SAC solder alloys and microstructure were examined by optical microscope and SEM and mechanical properties such as tensile tests, hardness test and density test of the lead solder alloys were explored. SAC305 and SAC405 alloys with different Ag content and constant Cu content under investigation and compare the value of SAC305 and SAC405. From this investigation, it was reported that tensile strength is increased, with an increase of Ag content and hardness and density were also increases in the same manner.

Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 &amp; SAC405)

Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology

Powder Metallurgy Progress

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)

The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder. In this study, an...

Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)

Online veröffentlicht: 25. Juli 2018

Seitenbereich: 49 - 57

DOI: https://doi.org/10.1515/pmp-2018-0006

Schlüsselwörter
Lead-free solder, Sn–Ag–Cu alloys, Microstructure, Mechanical properties

© 2018 P. Manoj Kumar et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)

Online veröffentlicht: 25. Juli 2018

Seitenbereich: 49 - 57

DOI: https://doi.org/10.1515/pmp-2018-0006

SchlüsselwörterLead-free solder, Sn–Ag–Cu alloys, Microstructure, Mechanical properties

© 2018 P. Manoj Kumar et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

Schlüsselwörter
Lead-free solder, Sn–Ag–Cu alloys, Microstructure, Mechanical properties