Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature
, oraz
22 lip 2014
O artykule
Data publikacji: 22 lip 2014
Zakres stron: 247 - 251
DOI: https://doi.org/10.2478/s13536-013-0182-9
Słowa kluczowe
© 2014 Wroclaw University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.
Nowak, Damian
Stafiniak, Andrzej
Dziedzic, Andrzej