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Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

Damian Nowak

Damian Nowak

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Nowak, Damian
, 
Andrzej Stafiniak

Andrzej Stafiniak

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Stafiniak, Andrzej
 and 
Andrzej Dziedzic

Andrzej Dziedzic

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Dziedzic, Andrzej
  
Jul 22, 2014
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Published Online: Jul 22, 2014
Page range: 247 - 251
DOI: https://doi.org/10.2478/s13536-013-0182-9
Keywords
© 2014 Wroclaw University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.
Nowak, Damian
Stafiniak, Andrzej
Dziedzic, Andrzej
Language:
English
Publication timeframe:
4 times per year
Journal Subjects:
Materials Sciences, Materials Sciences, other, Nanomaterials, Functional and Smart Materials, Materials Characterization and Properties
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