Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature
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22 juil. 2014
À propos de cet article
Publié en ligne: 22 juil. 2014
Pages: 247 - 251
DOI: https://doi.org/10.2478/s13536-013-0182-9
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© 2014 Wroclaw University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.
Nowak, Damian
Stafiniak, Andrzej
Dziedzic, Andrzej