Automatic Detection of Chip Pin Defect in Semiconductor Assembly Using Vision Measurement
, , oraz
05 sie 2022
O artykule
Data publikacji: 05 sie 2022
Zakres stron: 231 - 240
Otrzymano: 25 lis 2021
Przyjęty: 22 maj 2022
DOI: https://doi.org/10.2478/msr-2022-0029
Słowa kluczowe
© 2022 Shengfang Lu et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Lu, Shengfang
Artificial intelligence Industrial Technology Research Institute, Nanjing Institute of TechnologyNanjing, China
Jiangsu Engineering Research Center of IntelliSense Technology and System, Nanjing Institute of TechnologyNanjing, China
Zhang, Jian
Shool of Information and Communication Engineering, Nanjing Institute of TechnologyNanjing, China
Hao, Fei
Shool of Mechanical Engineering, Nanjing Institute of TechnologyNanjing, China
Jiao, Liangbao
Artificial intelligence Industrial Technology Research Institute, Nanjing Institute of TechnologyNanjing, China
Jiangsu Engineering Research Center of IntelliSense Technology and System, Nanjing Institute of TechnologyNanjing, China