Automatic Detection of Chip Pin Defect in Semiconductor Assembly Using Vision Measurement
, , et
05 août 2022
À propos de cet article
Publié en ligne: 05 août 2022
Pages: 231 - 240
Reçu: 25 nov. 2021
Accepté: 22 mai 2022
DOI: https://doi.org/10.2478/msr-2022-0029
Mots clés
© 2022 Shengfang Lu et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Lu, Shengfang
Artificial intelligence Industrial Technology Research Institute, Nanjing Institute of TechnologyNanjing, China
Jiangsu Engineering Research Center of IntelliSense Technology and System, Nanjing Institute of TechnologyNanjing, China
Zhang, Jian
Shool of Information and Communication Engineering, Nanjing Institute of TechnologyNanjing, China
Hao, Fei
Shool of Mechanical Engineering, Nanjing Institute of TechnologyNanjing, China
Jiao, Liangbao
Artificial intelligence Industrial Technology Research Institute, Nanjing Institute of TechnologyNanjing, China
Jiangsu Engineering Research Center of IntelliSense Technology and System, Nanjing Institute of TechnologyNanjing, China