Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations

Published Online: Jul 11, 2015

Page range: 445 - 450

Received: Jan 30, 2014

Accepted: Feb 27, 2015

DOI: https://doi.org/10.1515/msp-2015-0054

Keywords

thermal interface material (TIM), molecular dynamics simulations (MD), diffusivity, intermetallic compound (IMC)

© 2015

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.