Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations

Pubblicato online: 11 lug 2015

Pagine: 445 - 450

Ricevuto: 30 gen 2014

Accettato: 27 feb 2015

DOI: https://doi.org/10.1515/msp-2015-0054

Parole chiave

thermal interface material (TIM), molecular dynamics simulations (MD), diffusivity, intermetallic compound (IMC)

© 2015

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.