1. bookVolume 33 (2015): Issue 2 (June 2015)
Journal Details
License
Format
Journal
eISSN
2083-134X
First Published
16 Apr 2011
Publication timeframe
4 times per year
Languages
English
Open Access

Growth of intermetallic compound between indium-based thermal interface material and copper substrate: molecular dynamics simulations

Published Online: 11 Jul 2015
Volume & Issue: Volume 33 (2015) - Issue 2 (June 2015)
Page range: 445 - 450
Received: 30 Jan 2014
Accepted: 27 Feb 2015
Journal Details
License
Format
Journal
eISSN
2083-134X
First Published
16 Apr 2011
Publication timeframe
4 times per year
Languages
English
Abstract

The diffusion phenomenon occurring between copper and indium was investigated by molecular dynamics simulations. The calculations were carried out in various temperatures in aging domain with the use of the commercially available Materials Studio v.6. software. The results showed that the intermetallic compound (IMC) growth followed the parabolic law, which indicated this growth to be mainly controlled by volume diffusion. The growth activation energy was estimated at 7.48 kJ · mol-1.

Keywords

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