<abstract xmlns="http://www.w3.org/1999/xhtml">

<p>In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip [1]. With increasing demand of fine wires, current detection apparatus encounters some limitations. In this paper, a method to detect breakage of fine bonding wires using diffraction of light is proposed, where a laser head generates the light beam, and a slot introduced in the path of light source generates diffraction pattern. Then, irradiance loss of the corresponding diffraction pattern at the receiver could be observed, due to the presence of a wire. Simulation and experimental results show that the proposed method with a slot design renders satisfactory performance of wire detection.</p>
</abstract>

In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip [1]. With increasing demand of fine wires, current detection apparatus encounters some limitations. In this paper, a method to detect breakage of fine bonding wires using diffraction of light is proposed, where a laser head generates the light beam, and a slot introduced in the path of light source generates diffraction pattern. Then, irradiance loss of the corresponding diffraction pattern at the receiver could be observed, due to the presence of a wire. Simulation and experimental results show that the proposed method with a slot design renders satisfactory performance of wire detection.

A Method For Fine Bonding Wire Detection Using Light Diffraction

Shenyang University of Chemical Technology

International Journal on Smart Sensing and Intelligent Systems

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

{"article-title":"A Method For Fine Bonding Wire Detection Using Light Diffraction"}

In manufacturing industry, bonding wires are used to interconnect the pads of a semiconductor chip to terminals of a package containing the chip [1]. With...

A Method For Fine Bonding Wire Detection Using Light Diffraction

Data publikacji: 12 gru 2017

Zakres stron: 112 - 124

Otrzymano: 02 gru 2010

Przyjęty: 01 lut 2011

DOI: https://doi.org/10.21307/ijssis-2017-429

© 2011 Yong Xiao et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.