<abstract xml:lang="en" xmlns="http://www.w3.org/1999/xhtml"><p>Studies on electromigration phenomenon in thick-film structures on alumina and LTCC substrates are presented in this paper. The effects of storage of Au and Ag electrode patterns in temperature range up to 300 °C under voltage bias were examined. The leakage characteristics of electrodes with 100 μm spacing at 50 V dc bias as a function of time and temperature are presented and analyzed. Scanning electron microscope (SEM) equipped with the energy-dispersive X-ray spectroscopy (EDX) detector was applied for determination of metal ions transport. Test structures with Au-based conductive material are much more resistant to electromigration than Ag-based layers.</p></abstract>

Studies on electromigration phenomenon in thick-film structures on alumina and LTCC substrates are presented in this paper. The effects of storage of Au and Ag electrode patterns in temperature range up to 300 °C under voltage bias were examined. The leakage characteristics of electrodes with 100 μm spacing at 50 V dc bias as a function of time and temperature are presented and analyzed. Scanning electron microscope (SEM) equipped with the energy-dispersive X-ray spectroscopy (EDX) detector was applied for determination of metal ions transport. Test structures with Au-based conductive material are much more resistant to electromigration than Ag-based layers.

Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, Wybrzeże Wyspiańskiego 27, 50-370, Wrocław, Poland

Materials Science-Poland

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Studies on electromigration phenomenon in thick-film structures on alumina and LTCC substrates are presented in this paper. The effects of storage of Au and Ag...

Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

Publié en ligne: 22 juil. 2014

Pages: 247 - 251

DOI: https://doi.org/10.2478/s13536-013-0182-9

Mots clés
LTCC, thick-film, electromigration, reliability

© 2014 Wroclaw University of Technology

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

Publié en ligne: 22 juil. 2014

Pages: 247 - 251

DOI: https://doi.org/10.2478/s13536-013-0182-9

Mots clésLTCC, thick-film, electromigration, reliability

© 2014 Wroclaw University of Technology

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Mots clés
LTCC, thick-film, electromigration, reliability