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Solidification microstructure in a supercooled binary alloy

Hongfu Wang

Hongfu Wang

School of Mechanical Engineering, North University of ChinaTaiyuan, China
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Wang, Hongfu
, 
Cheng Tang

Cheng Tang

School of Mechanical Engineering, North University of ChinaTaiyuan, China
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Tang, Cheng
, 
Hongen An

Hongen An

Faculty of Engineering, University Malaysia SabahKota Kinabalu, Malaysia
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An, Hongen
 und 
Yuhong Zhao

Yuhong Zhao

College of Materials Science and Engineering, North University of ChinaTaiyuan, China
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Zhao, Yuhong
  
18. Dez. 2021
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Online veröffentlicht: 18. Dez. 2021
Seitenbereich: 383 - 394
Eingereicht: 18. Juni 2021
Akzeptiert: 11. Okt. 2021
DOI: https://doi.org/10.2478/msp-2021-0031
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© 2021 Hongfu Wang et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Fig. 1

Undercooling process and calculation of under-cooling.
Undercooling process and calculation of under-cooling.

Fig. 2

The recalescence process of Ni82Cu18 alloy under different undercooling.
The recalescence process of Ni82Cu18 alloy under different undercooling.

Fig. 3

Maximum recalescence temperature of Ni82Cu18 alloy under different undercooling.
Maximum recalescence temperature of Ni82Cu18 alloy under different undercooling.

Fig. 4

High-speed video camera images of Ni82Cu18 alloy with different undercooling degrees (A) 60 K; (B) 140 K; (C) 194 K; (D) 220 K; (E) 250 K.
High-speed video camera images of Ni82Cu18 alloy with different undercooling degrees (A) 60 K; (B) 140 K; (C) 194 K; (D) 220 K; (E) 250 K.

Fig. 5

Microstructure of Ni82Cu18 alloy at different undercooling. (A) 30 K; (B) 60 K; (C) 76 K; (D) 100 K; (E) 120 K; (F) 155 K; (G) 170 K; and (H) 210 K.
Microstructure of Ni82Cu18 alloy at different undercooling. (A) 30 K; (B) 60 K; (C) 76 K; (D) 100 K; (E) 120 K; (F) 155 K; (G) 170 K; and (H) 210 K.

Fig. 6

Evolution of grain size of Ni82Cu18 alloy under different undercooling.
Evolution of grain size of Ni82Cu18 alloy under different undercooling.

Fig. 7

(A) Evolution of component undercooling with initial undercooling. (B) Evolution of dendrite tip radius and dendrite growth velocity with initial undercooling.
(A) Evolution of component undercooling with initial undercooling. (B) Evolution of dendrite tip radius and dendrite growth velocity with initial undercooling.

Fig. 8

Dendrite morphology at different undercooling (A) 25 K; (B) 45 K; (C) 150 K.
Dendrite morphology at different undercooling (A) 25 K; (B) 45 K; (C) 150 K.

Fig. 9

(A) Microstructure of Ni82Cu18 alloy at 210 K; (B) grain orientation of Ni82Cu18 alloy at 210 K; (C) the inverse pole figure of (B).
(A) Microstructure of Ni82Cu18 alloy at 210 K; (B) grain orientation of Ni82Cu18 alloy at 210 K; (C) the inverse pole figure of (B).

Fig. 10

(A) Grain boundaries of Figure 9b; (B) misorientation angle distribution of (A); (C) local misorientation of Figure 9b; (D) local misorientation distribution of (C); (E) recrystallization distribution of Figure 9b (blue is recrystallization, yellow is substructure and red is a deformed grain); (F) recrystallized fraction of (E).
(A) Grain boundaries of Figure 9b; (B) misorientation angle distribution of (A); (C) local misorientation of Figure 9b; (D) local misorientation distribution of (C); (E) recrystallization distribution of Figure 9b (blue is recrystallization, yellow is substructure and red is a deformed grain); (F) recrystallized fraction of (E).

Fig. 11

(A) The solid fraction at different undercooling; (B) Stress at different undercooling; (C, D) TEM bright field image of Ni82Cu18 alloy at 270 K.TEM, transmission electron microscope.
(A) The solid fraction at different undercooling; (B) Stress at different undercooling; (C, D) TEM bright field image of Ni82Cu18 alloy at 270 K.TEM, transmission electron microscope.

Fig. 12

(A) Hardness of Ni82Cu18 alloy at different undercooling; (B) Microstructure of Ni82Cu18 alloy at 210 K.
(A) Hardness of Ni82Cu18 alloy at different undercooling; (B) Microstructure of Ni82Cu18 alloy at 210 K.
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