Open Access

Recovery of Metals from Printed Circuit Boards By Means of Electrostatic Separation

Dawid Franke

Dawid Franke

Silesian University of Technology
Orcid profile
Search for this author on
Sciendo|Google Scholar
Franke, Dawid
, 
Tomasz Suponik

Tomasz Suponik

Silesian University of Technology
Orcid profile
Search for this author on
Sciendo|Google Scholar
Suponik, Tomasz
, 
Paweł M. Nuckowski

Paweł M. Nuckowski

Silesian University of Technology
Orcid profile
Search for this author on
Sciendo|Google Scholar
Nuckowski, Paweł M.
, 
Klaudiusz Gołombek

Klaudiusz Gołombek

Silesian University of Technology
Orcid profile
Search for this author on
Sciendo|Google Scholar
Gołombek, Klaudiusz
 and 
Kamila Hyra

Kamila Hyra

Silesian University of Technology
Orcid profile
Search for this author on
Sciendo|Google Scholar
Hyra, Kamila
  
Aug 17, 2020
Recovery of Metals from Printed Circuit Boards By Means of Electrostatic Separation's Cover Image
About this article
Previous Article
Next Article
Cite
Download Cover
Published Online: Aug 17, 2020
Page range: 213 - 219
Received: Mar 01, 2020
Accepted: Jul 01, 2020
DOI: https://doi.org/10.2478/mspe-2020-0031
Keywords
© 2020 Dawid Franke et al., published by Sciendo
This work is licensed under the Creative Commons Attribution 4.0 International License.
Language:
English
Publication timeframe:
4 times per year
Journal Subjects:
Business and Economics, Business Management, Management Accounting, Financial Controlling, Cost Calculation, Investment, Engineering, Mechanical Engineering, Production Technology, Tools and Methods, Process Engineering and Industrial Engineering
Journal RSS Feed