Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy
, und
02. Aug. 2019
Über diesen Artikel
Online veröffentlicht: 02. Aug. 2019
Seitenbereich: 212 - 224
Eingereicht: 13. Apr. 2018
Akzeptiert: 18. Juli 2018
DOI: https://doi.org/10.2478/msp-2019-0032
Schlüsselwörter
© 2019 S.N. Alam et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.
Alam, S.N.
Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
Jindal, N.
Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India
Naithani, N.
Department of Metallurgical and Material Engineering, National Institute of Technology RourkelaRourkela, India