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Journals
Folia Horticulturae
Volume 35 (2023): Issue 2 (December 2023)
Open Access
Research on preparing seedling substrates using edible mushroom waste and application
Qi Liu
Qi Liu
College of Resources and Environment, Yunnan Agricultural University
Kunming, China
Yunnan Soil Fertilizer and Pollution Repair Engineering Research Center
Kunming, China
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Liu, Qi
,
Sheng Wang
Sheng Wang
Yunnan Soil Fertilizer and Pollution Repair Engineering Research Center
Kunming, China
College of Plant Protection, Yunnan Agricultural University
Kunming, China
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Wang, Sheng
,
Jingyu Zhang
Jingyu Zhang
College of Resources and Environment, Yunnan Agricultural University
Kunming, China
Yunnan Soil Fertilizer and Pollution Repair Engineering Research Center
Kunming, China
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Zhang, Jingyu
,
Tao He
Tao He
College of Plant Protection, Yunnan Agricultural University
Kunming, China
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He, Tao
,
Wen Chen
Wen Chen
College of Resources and Environment, Yunnan Agricultural University
Kunming, China
Yunnan Soil Fertilizer and Pollution Repair Engineering Research Center
Kunming, China
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Chen, Wen
,
Xuanyue Zhao
Xuanyue Zhao
College of Resources and Environment, Yunnan Agricultural University
Kunming, China
Yunnan Soil Fertilizer and Pollution Repair Engineering Research Center
Kunming, China
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Zhao, Xuanyue
,
Li Bao
Li Bao
College of Resources and Environment, Yunnan Agricultural University
Kunming, China
Yunnan Soil Fertilizer and Pollution Repair Engineering Research Center
Kunming, China
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Bao, Li
and
Naiming Zhang
Naiming Zhang
College of Resources and Environment, Yunnan Agricultural University
Kunming, China
Yunnan Soil Fertilizer and Pollution Repair Engineering Research Center
Kunming, China
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Zhang, Naiming
Dec 31, 2023
Folia Horticulturae
Volume 35 (2023): Issue 2 (December 2023)
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Article Category:
ORIGINAL ARTICLE
Published Online:
Dec 31, 2023
Page range:
275 - 285
Received:
Feb 01, 2023
Accepted:
Jun 20, 2023
DOI:
https://doi.org/10.2478/fhort-2023-0020
Keywords
mushroom waste
,
physicochemical properties
,
seedling substrate
,
vegetables
© 2023 Qi Liu et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.
