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Effect of Ag on Sn–Cu and Sn–Zn lead free solders


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[1] EL-DALY A.A., HAMMAD A.E., J. Alloy. Compd., 509 (34) (2011), 8554.10.1016/j.jallcom.2011.05.119Search in Google Scholar

[2] WU C.M.L., HUANG M.L., J. Electron. Mater., 31 (5) (2002), 442.10.1007/s11664-002-0098-3Search in Google Scholar

[3] REDDY B., BHATTACHARYA P., SINGH B., CHATTOPADHAYA K., J. Mater. Sci., 44 (2009), 2257.10.1007/s10853-008-3146-4Search in Google Scholar

[4] EL-DALY A.A., EL-TAHER A.M., DALLOUL T.R., Mater. Design, 55 (2014), 309.10.1016/j.matdes.2013.10.009Search in Google Scholar

[5] ROSALBINO F., ANGELINI E., ZANICCHI G., MARAZZA R., Mater. Chem. Phys., 109 (2008), 386.10.1016/j.matchemphys.2007.12.006Search in Google Scholar

[6] KANG S.K., SHIH D.Y., LEONARD D., HENDERSON D.W., GOSSELIN T.C., SUNG-IL YU J., CHOI W.K., JOM, 56 (6) (2004), 34.10.1007/s11837-004-0108-4Search in Google Scholar

[7] EL-DALY A.A., HAMMAD A.E., Mater. Design, 40 (2012), 292.10.1016/j.matdes.2012.04.007Search in Google Scholar

[8] ZHANG L., BAIXUE S., GAO L., CHEN Y., YU S., SHENG Z., ZENG G., J. Mater. Sci.- Mater. El., 20 (2009), 1193.10.1007/s10854-008-9850-7Search in Google Scholar

[9] YU D.Q., ZHAO J., WANG L., J. Alloy. Compd., 376 (1 - 2) (2004), 170.10.1016/j.jallcom.2004.01.012Search in Google Scholar

[10] MUDRYI S.I., SHATBLAVYI I.I., SKLYARCHUK V.I., PLEVACHUK Y.O., KOROLYSHYN A.V., YAKYMOVYCH A.S., Mater. Sci.+, 46 (4) (2011), 464.10.1007/s11003-011-9313-9Search in Google Scholar

[11] BIOCCA P., Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences, Kester, Illinois, USA, 2009.Search in Google Scholar

[12] MILLER C.M., ANDERSON I.E., SMITH J.F., J. Electron. Mater., 23 (7) (1994), 595.10.1007/BF02653344Search in Google Scholar

[13] OHNUMA I., MIYASHITA M., ANZAI K., LIU X.J., OHTANI H., KAINUMA R., ISHIDA K., J. Electron. Mater., 29 (10) (2000), 1137.10.1007/s11664-000-0004-9Search in Google Scholar

[14] KINNEY C., LINARES X., LEEK O., MORRIS J.W., J. Electron. Mater., 42 (4) (2013), 607.10.1007/s11664-012-2306-0Search in Google Scholar

[15] KIM K.S., HUH S.H., SUGANUMA K., J. Alloy. Compd., 352 (1 - 2) (2003), 226.10.1016/S0925-8388(02)01166-0Search in Google Scholar

[16] KARAKAYA I., THOMPSON W.T., Bull. Alloy Phase Diagr., 8 (4) (1987), 340.10.1007/BF02869270Search in Google Scholar

[17] SUBRANMANIAN P.R., PEREPEZKO J.H., J. Phase Equilib. Diff., 14 (1) (1993), 62.10.1007/BF02652162Search in Google Scholar

[18] LEHMAN L.P., ATHAVALE S.N., FULLEM T.Z., GIAMIS A.C., KINYANJUI R.K., LOWENSTEIN M., MATHER K., PATEL R., RAE D., WANG J., XING Y., ZAVALIJ L., BORGESEN P., COTTS E.J., J. Electron. Mater., 33 (12) (2004), 1429.10.1007/s11664-004-0083-0Search in Google Scholar

[19] EL-DALY A.A., EL-TANTAWY F., HAMMAD A.E., GAAFAR M.S., EL-MOSSALAMY E.H., AL-GHAMDI A.A., J. Alloy. Compd., 509 (26) (2011), 7238.10.1016/j.jallcom.2011.01.062Search in Google Scholar

[20] FREITAS E.S., OSORIO W.R., SPINELLI J.E., GARCIA A., Microelectron. Reliab., 54 (6 - 7) (2014), 1392.10.1016/j.microrel.2014.02.014Search in Google Scholar

[21] YOU T., KIM Y., JUNG W., MOON J., CHOE H., J. Alloy. Compd., 486 (1 - 2) (2009), 242.10.1016/j.jallcom.2009.07.085Search in Google Scholar

[22] HU X., CHEN W., WU B., Mat. Sci. Eng. A-Struct., 556 (2012), 816.10.1016/j.msea.2012.07.073Search in Google Scholar

[23] OHNUMA I., LIU X.J., OHTANI H., ISHIDA K., J. Electron. Mater., 28 (11) (1999), 1164.10.1007/s11664-999-0152-5Search in Google Scholar

[24] LUO T., CHEN Z., HU A., LI M., Mat. Sci. Eng. AStruct., 556 (2012), 885.10.1016/j.msea.2012.07.086Search in Google Scholar

[25] WEI C., LIU Y.C., HAN Y.J., WAN J.B., YANG K., J. Alloy. Compd., 464 (1 - 2) (2008), 301.10.1016/j.jallcom.2007.09.103Search in Google Scholar

[26] SONG J.M., LIN K.L., J. Mater. Res., 18 (9) (2003), 2060.10.1557/JMR.2003.0290Search in Google Scholar

[27] CHEN K.I., LIN K.L., J. Electron. Mater., 31 (8) (2002), 861.Search in Google Scholar

[28] AHMED M., FOUZDER T., SHARIF A, GAIN A.K., CHAN Y.C., Microelectron. Reliab., 50 (2010), 1134.10.1016/j.microrel.2010.03.017Search in Google Scholar

[29] LIN K.L., SHIH C.L., J. Electron. Mater., 32 (12) (2003), 1496.10.1007/s11664-003-0120-4Search in Google Scholar

[30] CHEN K.I., CHENG S.C., WU S., LIN K.L., J. Alloy. Compd., 416 (2006), 98.10.1016/j.jallcom.2005.08.034Search in Google Scholar

[31] SONG J.M., LAN G.F., LUI T.S., CHEN L.H., Scripta Mater., 48 (8) (2003), 1047.10.1016/S1359-6462(02)00647-4Search in Google Scholar

[32] SONG J.M., LUI T.S., LANG F., CHEN L.H., J. Alloy. Compd., 379 (1 - 2) (2004), 233.10.1016/j.jallcom.2004.02.031Search in Google Scholar

[33] LUO T., CHEN Z., HU A., LI M., LI P., Microelectron. Reliab., 53 (12) (2013), 2018.10.1016/j.microrel.2013.06.010Search in Google Scholar

eISSN:
2083-134X
Language:
English
Publication timeframe:
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Journal Subjects:
Materials Sciences, other, Nanomaterials, Functional and Smart Materials, Materials Characterization and Properties