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Materials Science-Poland
Volume 33 (2015): Issue 2 (June 2015)
Open Access
Effect of Ag on Sn–Cu and Sn–Zn lead free solders
S.N. Alam
S.N. Alam
,
Prerna Mishra
Prerna Mishra
and
Rajnish Kumar
Rajnish Kumar
| Jul 11, 2015
Materials Science-Poland
Volume 33 (2015): Issue 2 (June 2015)
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Published Online:
Jul 11, 2015
Page range:
317 - 330
Received:
Aug 14, 2014
Accepted:
Feb 11, 2015
DOI:
https://doi.org/10.1515/msp-2015-0048
© 2015
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.
S.N. Alam
Department of Metallurgical and Materials Engineering, National Institute of Technology Rourkela, Orissa, Pin-769008, India
Prerna Mishra
Department of Metallurgical and Materials Engineering, National Institute of Technology Rourkela, Orissa, Pin-769008, India
Rajnish Kumar
Department of Metallurgical and Materials Engineering, National Institute of Technology Rourkela, Orissa, Pin-769008, India