1. bookVolume 33 (2015): Issue 2 (June 2015)
Journal Details
License
Format
Journal
eISSN
2083-134X
First Published
16 Apr 2011
Publication timeframe
4 times per year
Languages
English
access type Open Access

Effect of Ag on Sn–Cu and Sn–Zn lead free solders

Published Online: 11 Jul 2015
Volume & Issue: Volume 33 (2015) - Issue 2 (June 2015)
Page range: 317 - 330
Received: 14 Aug 2014
Accepted: 11 Feb 2015
Journal Details
License
Format
Journal
eISSN
2083-134X
First Published
16 Apr 2011
Publication timeframe
4 times per year
Languages
English
Abstract

Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.

Keywords

[1] EL-DALY A.A., HAMMAD A.E., J. Alloy. Compd., 509 (34) (2011), 8554.10.1016/j.jallcom.2011.05.119Search in Google Scholar

[2] WU C.M.L., HUANG M.L., J. Electron. Mater., 31 (5) (2002), 442.10.1007/s11664-002-0098-3Search in Google Scholar

[3] REDDY B., BHATTACHARYA P., SINGH B., CHATTOPADHAYA K., J. Mater. Sci., 44 (2009), 2257.10.1007/s10853-008-3146-4Search in Google Scholar

[4] EL-DALY A.A., EL-TAHER A.M., DALLOUL T.R., Mater. Design, 55 (2014), 309.10.1016/j.matdes.2013.10.009Search in Google Scholar

[5] ROSALBINO F., ANGELINI E., ZANICCHI G., MARAZZA R., Mater. Chem. Phys., 109 (2008), 386.10.1016/j.matchemphys.2007.12.006Search in Google Scholar

[6] KANG S.K., SHIH D.Y., LEONARD D., HENDERSON D.W., GOSSELIN T.C., SUNG-IL YU J., CHOI W.K., JOM, 56 (6) (2004), 34.10.1007/s11837-004-0108-4Search in Google Scholar

[7] EL-DALY A.A., HAMMAD A.E., Mater. Design, 40 (2012), 292.10.1016/j.matdes.2012.04.007Search in Google Scholar

[8] ZHANG L., BAIXUE S., GAO L., CHEN Y., YU S., SHENG Z., ZENG G., J. Mater. Sci.- Mater. El., 20 (2009), 1193.10.1007/s10854-008-9850-7Search in Google Scholar

[9] YU D.Q., ZHAO J., WANG L., J. Alloy. Compd., 376 (1 - 2) (2004), 170.10.1016/j.jallcom.2004.01.012Search in Google Scholar

[10] MUDRYI S.I., SHATBLAVYI I.I., SKLYARCHUK V.I., PLEVACHUK Y.O., KOROLYSHYN A.V., YAKYMOVYCH A.S., Mater. Sci.+, 46 (4) (2011), 464.10.1007/s11003-011-9313-9Search in Google Scholar

[11] BIOCCA P., Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences, Kester, Illinois, USA, 2009.Search in Google Scholar

[12] MILLER C.M., ANDERSON I.E., SMITH J.F., J. Electron. Mater., 23 (7) (1994), 595.10.1007/BF02653344Search in Google Scholar

[13] OHNUMA I., MIYASHITA M., ANZAI K., LIU X.J., OHTANI H., KAINUMA R., ISHIDA K., J. Electron. Mater., 29 (10) (2000), 1137.10.1007/s11664-000-0004-9Search in Google Scholar

[14] KINNEY C., LINARES X., LEEK O., MORRIS J.W., J. Electron. Mater., 42 (4) (2013), 607.10.1007/s11664-012-2306-0Search in Google Scholar

[15] KIM K.S., HUH S.H., SUGANUMA K., J. Alloy. Compd., 352 (1 - 2) (2003), 226.10.1016/S0925-8388(02)01166-0Search in Google Scholar

[16] KARAKAYA I., THOMPSON W.T., Bull. Alloy Phase Diagr., 8 (4) (1987), 340.10.1007/BF02869270Search in Google Scholar

[17] SUBRANMANIAN P.R., PEREPEZKO J.H., J. Phase Equilib. Diff., 14 (1) (1993), 62.10.1007/BF02652162Search in Google Scholar

[18] LEHMAN L.P., ATHAVALE S.N., FULLEM T.Z., GIAMIS A.C., KINYANJUI R.K., LOWENSTEIN M., MATHER K., PATEL R., RAE D., WANG J., XING Y., ZAVALIJ L., BORGESEN P., COTTS E.J., J. Electron. Mater., 33 (12) (2004), 1429.10.1007/s11664-004-0083-0Search in Google Scholar

[19] EL-DALY A.A., EL-TANTAWY F., HAMMAD A.E., GAAFAR M.S., EL-MOSSALAMY E.H., AL-GHAMDI A.A., J. Alloy. Compd., 509 (26) (2011), 7238.10.1016/j.jallcom.2011.01.062Search in Google Scholar

[20] FREITAS E.S., OSORIO W.R., SPINELLI J.E., GARCIA A., Microelectron. Reliab., 54 (6 - 7) (2014), 1392.10.1016/j.microrel.2014.02.014Search in Google Scholar

[21] YOU T., KIM Y., JUNG W., MOON J., CHOE H., J. Alloy. Compd., 486 (1 - 2) (2009), 242.10.1016/j.jallcom.2009.07.085Search in Google Scholar

[22] HU X., CHEN W., WU B., Mat. Sci. Eng. A-Struct., 556 (2012), 816.10.1016/j.msea.2012.07.073Search in Google Scholar

[23] OHNUMA I., LIU X.J., OHTANI H., ISHIDA K., J. Electron. Mater., 28 (11) (1999), 1164.10.1007/s11664-999-0152-5Search in Google Scholar

[24] LUO T., CHEN Z., HU A., LI M., Mat. Sci. Eng. AStruct., 556 (2012), 885.10.1016/j.msea.2012.07.086Search in Google Scholar

[25] WEI C., LIU Y.C., HAN Y.J., WAN J.B., YANG K., J. Alloy. Compd., 464 (1 - 2) (2008), 301.10.1016/j.jallcom.2007.09.103Search in Google Scholar

[26] SONG J.M., LIN K.L., J. Mater. Res., 18 (9) (2003), 2060.10.1557/JMR.2003.0290Search in Google Scholar

[27] CHEN K.I., LIN K.L., J. Electron. Mater., 31 (8) (2002), 861.Search in Google Scholar

[28] AHMED M., FOUZDER T., SHARIF A, GAIN A.K., CHAN Y.C., Microelectron. Reliab., 50 (2010), 1134.10.1016/j.microrel.2010.03.017Search in Google Scholar

[29] LIN K.L., SHIH C.L., J. Electron. Mater., 32 (12) (2003), 1496.10.1007/s11664-003-0120-4Search in Google Scholar

[30] CHEN K.I., CHENG S.C., WU S., LIN K.L., J. Alloy. Compd., 416 (2006), 98.10.1016/j.jallcom.2005.08.034Search in Google Scholar

[31] SONG J.M., LAN G.F., LUI T.S., CHEN L.H., Scripta Mater., 48 (8) (2003), 1047.10.1016/S1359-6462(02)00647-4Search in Google Scholar

[32] SONG J.M., LUI T.S., LANG F., CHEN L.H., J. Alloy. Compd., 379 (1 - 2) (2004), 233.10.1016/j.jallcom.2004.02.031Search in Google Scholar

[33] LUO T., CHEN Z., HU A., LI M., LI P., Microelectron. Reliab., 53 (12) (2013), 2018.10.1016/j.microrel.2013.06.010Search in Google Scholar

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