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Journals
Journal of Electrical Engineering
Volume 69 (2018): Issue 1 (January 2018)
Open Access
A fast and simple bonding method for low cost microfluidic chip fabrication
Zhifu Yin
Zhifu Yin
and
Helin Zou
Helin Zou
| Mar 07, 2018
Journal of Electrical Engineering
Volume 69 (2018): Issue 1 (January 2018)
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Published Online:
Mar 07, 2018
Page range:
72 - 78
Received:
Sep 11, 2017
DOI:
https://doi.org/10.1515/jee-2018-0010
Keywords
microfluidic chip
,
tape assist bonding
,
numerical simulation
© 2018 Zhifu Yin et al., published by De Gruyter Open
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.
Zhifu Yin
School of Mechanical Science and Engineering, Jilin University
Changchun, China
Helin Zou
Key Laboratory for Micro/Nano Technology and Systems of Liaoning Province, Dalian University of Technology
Dalian, China