Accès libre

A fast and simple bonding method for low cost microfluidic chip fabrication

 et    | 07 mars 2018
À propos de cet article

Citez

Zhifu Yin
School of Mechanical Science and Engineering, Jilin UniversityChangchun, China
Helin Zou
Key Laboratory for Micro/Nano Technology and Systems of Liaoning Province, Dalian University of TechnologyDalian, China
eISSN:
1339-309X
Langue:
Anglais
Périodicité:
6 fois par an
Sujets de la revue:
Engineering, Introductions and Overviews, other