<abstract xmlns="http://www.w3.org/1999/xhtml"> The paper deals with the study of interaction between Cu, Al substrates (purity 5N) and ZnAl4, ZnAg6Al6 zinc solders for higher application temperatures. Soldering was performed with power ultrasound in the air without flux application at temperature 420 °C. Acting time of ultrasonic vibration was 3 s and ultrasound frequency was 40 kHz. Soldered joints were assessed by optical light microscopy and EDX microanalysis. Intermetallic layers (IM) CuZn4 and Cu5Zn8 were formed at the Cu/ZnAl4 boundary. The βZn-αAl mechanical mixture was formed at the Al/ZnAl4 boundary. AgZn3 and Cu5Zn8 IM layers were formed at the Cu/ZnAg6Al6 boundary, and mechanical mixture of βZn-αAl and AgZn3 intermetallic mixture were formed at the boundary Al/ZnAg6Al6.</abstract>

The paper deals with the study of interaction between Cu, Al substrates (purity 5N) and ZnAl4, ZnAg6Al6 zinc solders for higher application temperatures. Soldering was performed with power ultrasound in the air without flux application at temperature 420 °C. Acting time of ultrasonic vibration was 3 s and ultrasound frequency was 40 kHz. Soldered joints were assessed by optical light microscopy and EDX microanalysis. Intermetallic layers (IM) CuZn4 and Cu5Zn8 were formed at the Cu/ZnAl4 boundary. The βZn-αAl mechanical mixture was formed at the Al/ZnAl4 boundary. AgZn3 and Cu5Zn8 IM layers were formed at the Cu/ZnAg6Al6 boundary, and mechanical mixture of βZn-αAl and AgZn3 intermetallic mixture were formed at the boundary Al/ZnAg6Al6.

Research of Interaction Between Zn Based Solders and Cu, Al Substrates

Slovak University of Technology in Bratislava, Faculty of Materials Science and Technology in Trnava, Institute of Production Technologies, ul. Jána Bottu 25, 917 24 Trnava, Slovak Republic

Research Papers Faculty of Materials Science and Technology Slovak University of Technology

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

{"article-title":"Research of Interaction Between Zn Based Solders and Cu, Al Substrates"}

The paper deals with the study of interaction between Cu, Al substrates (purity 5N) and ZnAl4, ZnAg6Al6 zinc solders for higher application temperatures....

Research of Interaction Between Zn Based Solders and Cu, Al Substrates

Data publikacji: 25 lis 2014

Zakres stron: 59 - 65

DOI: https://doi.org/10.2478/rput-2014-0028

Słowa kluczowe
zinc solders, ultrasonic soldering, copper, aluminium, higher application temperatures

© by Michal Prach

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Research of Interaction Between Zn Based Solders and Cu, Al Substrates

Data publikacji: 25 lis 2014

Zakres stron: 59 - 65

DOI: https://doi.org/10.2478/rput-2014-0028

Słowa kluczowezinc solders, ultrasonic soldering, copper, aluminium, higher application temperatures

© by Michal Prach

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

Słowa kluczowe
zinc solders, ultrasonic soldering, copper, aluminium, higher application temperatures