1. bookTom 22 (2014): Zeszyt 34 (June 2014)
Informacje o czasopiśmie
License
Format
Czasopismo
eISSN
1338-0532
Pierwsze wydanie
03 Mar 2011
Częstotliwość wydawania
2 razy w roku
Języki
Angielski
Otwarty dostęp

Research of Interaction Between Zn Based Solders and Cu, Al Substrates

Data publikacji: 25 Nov 2014
Tom & Zeszyt: Tom 22 (2014) - Zeszyt 34 (June 2014)
Zakres stron: 59 - 65
Informacje o czasopiśmie
License
Format
Czasopismo
eISSN
1338-0532
Pierwsze wydanie
03 Mar 2011
Częstotliwość wydawania
2 razy w roku
Języki
Angielski

1. SUGANUMA, K., KIM S. J., KIM K. S., 2009. High-Temperature Lead-Free Solders: Properties and Possibilities. JOM, Vol. 61, No. 1, pp. 64-7110.1007/s11837-009-0013-ySearch in Google Scholar

2. KROUPA, A., ANDERSSON, D., HOO, N. et al., 2012. Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering. Journal of Materials Engineering and Performance, Vol. 21(5), pp. 629-63710.1007/s11665-012-0125-3Search in Google Scholar

3. MA, L., LONG, W., et al., 2013. Development of a Binary Zn-Based Solder Alloy for Joining Wrought Magnesium Alloy AZ31B. ASM International, Vol. 22, Is. 1, pp. 118-12210.1007/s11665-012-0241-0Search in Google Scholar

4. MA, L., HE, D.Y., LI, X.Y., JIANG, J.M., 2010. High-frequency induction soldering of magnesium alloy AZ31B using a Zn-Al filler metal. Materials Letters, Vol. 64, pp. 596-59810.1016/j.matlet.2009.12.012Search in Google Scholar

5. HAQUE, A., LIM, B.H., HASEEB, A.S.M.A., MASJUKI, H.H., 2012. Die attach properties of Zn-Al-Mg-Ga based high-temperature lead-free solder on Cu lead-frame.10.1007/s10854-011-0511-xSearch in Google Scholar

Journal of Material Science: Materials in Electronics, Vol. 23, pp. 115-123Search in Google Scholar

6. TAKAKU, Y., FELICIA, L., OHNUMA, I., et al., 2008. Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders. Journal of Electronic Materials, Vol. 37, Is. 3, pp. 314-32310.1007/s11664-007-0344-9Search in Google Scholar

7. HAQUE, A., WON, Y.S., LIM, B.H., et al., 2010. Effect of Ni Metallization on Interfacial Reactions and Die Attach Properties of Zn-Al-Mg-Ga High Temperature Lead-free Solder. 34th International Electronic Manufacturing Technology Conference, Malaysia10.1109/IEMT.2010.5746721Search in Google Scholar

8. LI, Y., ZHAO, W., LENG, X., FU, Q., et al., 2011. Microstructure evolution and mechanical properties of ultrasonic-assisted soldering joints of 2024 aluminum alloys. Transactions of Nonferrous Metals Society of China, Vol. 21, pp. 1937-194310.1016/S1003-6326(11)60953-9Search in Google Scholar

9. XIAO, Y., JI, H., LI, M., KIM, J., 2013. Ultrasound-assisted brazing of Cu/Al dissimilar metals using a Zn-3Al filler metal. Materials and Design 52, 2013,pp. 740-74710.1016/j.matdes.2013.06.016Search in Google Scholar

10. KOLEŇÁK, R., KOSTOLNÝ, I., ČIČKA, R., 2014. Research of fluxless soldering of high-purity aluminium with solders type Zn-Al. Advanced Materials Research. Clausthal- Zellerfeld: Trans Tech Publications, ISSN 1022-6680, Vol. 905, pp. 132-13610.4028/www.scientific.net/AMR.905.132Search in Google Scholar

11. PRACH, M., KOLEŇÁK, R., SAHUL, M., 2014. Ultrasonic soldering of copper substrate by zinc solders. International Doctoral Seminar 2014, Zielona Góra, Poland, ISBN 978-80-8096-195-4, pp. 193-199Search in Google Scholar

12. HILLEN, F., RASS, I.J., LUGSCHEIDER, E., SMITH, R.W., 2000. Low temperature joining for heat exchangers and other applications. Advanced Brazing and Soldering Technologies. ASM International, pp. 445-452. Search in Google Scholar

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