Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes
oraz
07 mar 2023
O artykule
Kategoria artykułu: PAPERS
Data publikacji: 07 mar 2023
Zakres stron: 57 - 63
Otrzymano: 21 sty 2023
DOI: https://doi.org/10.2478/jee-2023-0007
Słowa kluczowe
© 2023 Gurleen Dhillon et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Dhillon, Gurleen
Electronics and Communication Engineering Department, Thapar Institute of Engineering and TechnologyPatiala, Punjab, India
Sandha, Karmjit Singh
Electronics and Communication Engineering Department, Thapar Institute of Engineering and TechnologyPatiala, Punjab, India