Delay analysis of mixed CNT bundles as global interconnect for nanotechnology nodes
e
07 mar 2023
INFORMAZIONI SU QUESTO ARTICOLO
Categoria dell'articolo: PAPERS
Pubblicato online: 07 mar 2023
Pagine: 57 - 63
Ricevuto: 21 gen 2023
DOI: https://doi.org/10.2478/jee-2023-0007
Parole chiave
© 2023 Gurleen Dhillon et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.
Dhillon, Gurleen
Electronics and Communication Engineering Department, Thapar Institute of Engineering and TechnologyPatiala, Punjab, India
Sandha, Karmjit Singh
Electronics and Communication Engineering Department, Thapar Institute of Engineering and TechnologyPatiala, Punjab, India