<abstract xmlns="http://www.w3.org/1999/xhtml">

<p>A non-destructive, non-contact inspection system for packaged integrated circuits using terahertz (THz) radiation is tested. Our results show that we are able to reconstruct the internal structure of the IC, like the microelectronic chip and the interconnections. Due to the limitation of the system and the wavelength of THz radiation the fine bonding wires could not be detected. However, we show that the THz technology will be a valuable tool for the automatic online inspection of packaged integrated circuits.</p>
</abstract>

A non-destructive, non-contact inspection system for packaged integrated circuits using terahertz (THz) radiation is tested. Our results show that we are able to reconstruct the internal structure of the IC, like the microelectronic chip and the interconnections. Due to the limitation of the system and the wavelength of THz radiation the fine bonding wires could not be detected. However, we show that the THz technology will be a valuable tool for the automatic online inspection of packaged integrated circuits.

Inspection of Packaged Integrated Circuits using Terahertz Radiation

International Journal on Smart Sensing and Intelligent Systems

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

{"article-title":"Inspection of Packaged Integrated Circuits using Terahertz Radiation"}

A non-destructive, non-contact inspection system for packaged integrated circuits using terahertz (THz) radiation is tested. Our results show that we are able...

Inspection of Packaged Integrated Circuits using Terahertz Radiation

Data publikacji: 15 lut 2020

Zakres stron: 1 - 4

DOI: https://doi.org/10.21307/ijssis-2019-056

Słowa kluczowe
terahertz, Time domain spectroscopy, Wavelet transformation, Wavelet denosing, packaged integrated circuit inspection

© 2019 Andreas Fritz et al., published by Sciendo.

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Inspection of Packaged Integrated Circuits using Terahertz Radiation

Data publikacji: 15 lut 2020

Zakres stron: 1 - 4

DOI: https://doi.org/10.21307/ijssis-2019-056

Słowa kluczoweterahertz, Time domain spectroscopy, Wavelet transformation, Wavelet denosing, packaged integrated circuit inspection

© 2019 Andreas Fritz et al., published by Sciendo.

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Słowa kluczowe
terahertz, Time domain spectroscopy, Wavelet transformation, Wavelet denosing, packaged integrated circuit inspection