<abstract xmlns="http://www.w3.org/1999/xhtml">

<p>The maximum undercooling that has been achieved for Ni-Cu alloy, by using molten glass purification and cyclic super-heating technology, is 270 K. With the help of high-speed photography, the solidification front images of Ni-Cu alloy at various typical undercooling were obtained. Two grain refinements occurred in the range of 60 K&lt; ΔT &lt; 100 K and ΔT > 170 K, the solidification front became smoother, and the solidification position appeared randomly. With the increase of undercooling, the transition from solute diffusion to thermal diffusion leads to the transition from coarse dendrite to directional fine dendrite. At large undercooling, considerable stress is accumulated and some dislocations exist in the microstructure. However, the proportion of high-angle grain boundaries is as high as 89%, with twin boundaries of 13.6% and most strain-free structures, and the microhardness decreases sharply. This indicates that the accumulated stress at large undercooling causes the plastic strains in the microstructure, and in the later stage of recalescence, part of the plastic strains is dissipated by the system and acts as the driving force to promote the recrystallization of the microstructure.</p>
</abstract>

The maximum undercooling that has been achieved for Ni-Cu alloy, by using molten glass purification and cyclic super-heating technology, is 270 K. With the help of high-speed photography, the solidification front images of Ni-Cu alloy at various typical undercooling were obtained. Two grain refinements occurred in the range of 60 K< ΔT < 100 K and ΔT > 170 K, the solidification front became smoother, and the solidification position appeared randomly. With the increase of undercooling, the transition from solute diffusion to thermal diffusion leads to the transition from coarse dendrite to directional fine dendrite. At large undercooling, considerable stress is accumulated and some dislocations exist in the microstructure. However, the proportion of high-angle grain boundaries is as high as 89%, with twin boundaries of 13.6% and most strain-free structures, and the microhardness decreases sharply. This indicates that the accumulated stress at large undercooling causes the plastic strains in the microstructure, and in the later stage of recalescence, part of the plastic strains is dissipated by the system and acts as the driving force to promote the recrystallization of the microstructure.

Solidification microstructure in a supercooled binary alloy

College of Materials Science and Engineering

Materials Science-Poland

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

{"article-title":"Solidification microstructure in a supercooled binary alloy"}

The maximum undercooling that has been achieved for Ni-Cu alloy, by using molten glass purification and cyclic super-heating technology, is 270 K. With the help of high-speed photography, the solidification front images of Ni-Cu alloy at various typical undercooling were obtained. Two grain refinements occurred in the range of 60 K 170 K, the solidification front became smoother, and the solidification position appeared randomly. With the increase of undercooling, the transition from solute diffusion to thermal diffusion leads to the transition from coarse dendrite to directional fine dendrite. At large undercooling, considerable stress is accumulated and some dislocations exist in the microstructure. However, the proportion of high-angle grain boundaries is as high as 89%, with twin boundaries of 13.6% and most strain-free structures, and the microhardness decreases sharply. This indicates that the accumulated stress at large undercooling causes the plastic strains in the microstructure, and in the later stage of recalescence, part of the plastic strains is dissipated by the system and acts as the driving force to promote the recrystallization of the microstructure.

The maximum undercooling that has been achieved for Ni-Cu alloy, by using molten glass purification and cyclic super-heating technology, is 270 K. With the...

Solidification microstructure in a supercooled binary alloy

Publié en ligne: 18 déc. 2021

Pages: 383 - 394

Reçu: 18 juin 2021

Accepté: 11 oct. 2021

DOI: https://doi.org/10.2478/msp-2021-0031

Mots clés
alloy, microstructure, rapid solidification, crystal growth

© 2021 Hongfu Wang et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Solidification microstructure in a supercooled binary alloy

Publié en ligne: 18 déc. 2021

Pages: 383 - 394

Reçu: 18 juin 2021

Accepté: 11 oct. 2021

DOI: https://doi.org/10.2478/msp-2021-0031

Mots clésalloy, microstructure, rapid solidification, crystal growth

© 2021 Hongfu Wang et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Mots clés
alloy, microstructure, rapid solidification, crystal growth