Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)
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25. Juli 2018
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Online veröffentlicht: 25. Juli 2018
Seitenbereich: 49 - 57
DOI: https://doi.org/10.1515/pmp-2018-0006
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© 2018 P. Manoj Kumar et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.
Kumar, P. Manoj
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of MiskolcHungary
Gergely, G.
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of MiskolcHungary
Horváth, D. K.
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of MiskolcHungary
Gácsi, Z.
Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of MiskolcHungary