Open Access

Influence of heat flow direction on solder ball interfacial layer


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Alexandr Otáhal
Department of Microelectronics, Brno University of TechnologyBrno
Ivan Szendiuch
Department of Microelectronics, Brno University of TechnologyBrno
eISSN:
1339-309X
Language:
English
Publication timeframe:
6 times per year
Journal Subjects:
Engineering, Introductions and Overviews, other