Open Access

Improving the Ohmic Properties of Au/Ni–Mg/P–GaN Contacts by Adding Swcnt Metallization Interlayer Between Metal and P–GaN Layers

Jozef Liday
Institute of Electronics and Photonics, Slovak University of Technology, Ilkoviova 3, 812 19 Bratislava, Slovakia
Peter Vogrinčič
Institute of Electronics and Photonics, Slovak University of Technology, Ilkoviova 3, 812 19 Bratislava, Slovakia
Viliam Vretenár
Danubia NanoTech, s.r.o., Ilkoviova 3, 841 04 Bratislava, Slovakia
Ivan Hotový
Institute of Electronics and Photonics, Slovak University of Technology, Ilkoviova 3, 812 19 Bratislava, Slovakia
Mário Kotlár
Institute of Electronics and Photonics, Slovak University of Technology, Ilkoviova 3, 812 19 Bratislava, Slovakia
Marián Marton
Institute of Electronics and Photonics, Slovak University of Technology, Ilkoviova 3, 812 19 Bratislava, Slovakia
Vlastimil Řeháček
Institute of Electronics and Photonics, Slovak University of Technology, Ilkoviova 3, 812 19 Bratislava, Slovakia
ISSN:
1335-3632
Language:
English
Publication timeframe:
6 times per year
Journal Subjects:
Engineering, Introductions and Overviews, other