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Enhancing Microstructural and Thermal Properties of Tinipd Shape Memory Alloys Through Copper Addition

Abid Hussain

Abid Hussain

Department of Mechanical Engineering, University of Engineering and TechnologyPeshawar, Pakistan
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Hussain, Abid
, 
Afzal Khan

Afzal Khan

Department of Mechanical Engineering, University of Engineering and TechnologyPeshawar, Pakistan
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Khan, Afzal
, 
Muhammad Imran Khan

Muhammad Imran Khan

Ghulam Ishaq Khan (GIK) Institute of Engineering and Science and TechnologyPakistan
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Khan, Muhammad Imran
 and 
Saif Ur Rehman

Saif Ur Rehman

Institute of Industrial Control SystemRawalpindi, Pakistan
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Rehman, Saif Ur
  
Mar 26, 2025
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Published Online: Mar 26, 2025
Page range: 66 - 81
Received: Oct 24, 2024
Accepted: Jan 06, 2025
DOI: https://doi.org/10.2478/adms-2025-0004
Keywords
© 2025 Abid Hussain et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.
Hussain, Abid
Department of Mechanical Engineering, University of Engineering and TechnologyPeshawar, Pakistan
Khan, Afzal
Department of Mechanical Engineering, University of Engineering and TechnologyPeshawar, Pakistan
Khan, Muhammad Imran
Ghulam Ishaq Khan (GIK) Institute of Engineering and Science and TechnologyPakistan
Rehman, Saif Ur
Institute of Industrial Control SystemRawalpindi, Pakistan
Language:
English
Publication timeframe:
4 times per year
Journal Subjects:
Materials Sciences, Functional and Smart Materials
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