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Enhancing Microstructural and Thermal Properties of Tinipd Shape Memory Alloys Through Copper Addition

Abid Hussain

Abid Hussain

Department of Mechanical Engineering, University of Engineering and TechnologyPeshawar, Pakistan
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Hussain, Abid
, 
Afzal Khan

Afzal Khan

Department of Mechanical Engineering, University of Engineering and TechnologyPeshawar, Pakistan
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Khan, Afzal
, 
Muhammad Imran Khan

Muhammad Imran Khan

Ghulam Ishaq Khan (GIK) Institute of Engineering and Science and TechnologyPakistan
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Khan, Muhammad Imran
 e 
Saif Ur Rehman

Saif Ur Rehman

Institute of Industrial Control SystemRawalpindi, Pakistan
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Rehman, Saif Ur
  
26 mar 2025
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Pubblicato online: 26 mar 2025
Pagine: 66 - 81
Ricevuto: 24 ott 2024
Accettato: 06 gen 2025
DOI: https://doi.org/10.2478/adms-2025-0004
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© 2025 Abid Hussain et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.
Hussain, Abid
Department of Mechanical Engineering, University of Engineering and TechnologyPeshawar, Pakistan
Khan, Afzal
Department of Mechanical Engineering, University of Engineering and TechnologyPeshawar, Pakistan
Khan, Muhammad Imran
Ghulam Ishaq Khan (GIK) Institute of Engineering and Science and TechnologyPakistan
Rehman, Saif Ur
Institute of Industrial Control SystemRawalpindi, Pakistan
Lingua:
Inglese
Frequenza di pubblicazione:
4 volte all'anno
Argomenti della rivista:
Scienze materiali, Materiali funzionali ed intelligenti
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