<abstract xmlns="http://www.w3.org/1999/xhtml">

This paper focuses on the development of a technological challenges of manufacturing the planar ceramic vacuum sensor based on the principles of hot-cathode ionization in the Bayard-Alpert configuration. The goal is to simplify the technological process by utilizing planar platinum structures with gold electrical paths instead of 3-dimensional structures. Various methods were tested, including the use of carbon-based SVM (Sacrifice Volume Materials) materials, but without success. Wet-etching using potassium hydroxide on Al2O3 substrates showed promise results. The findings highlight the challenges and progress made in developing the thermo-emittercomponent of the vacuum sensor.
</abstract>

This paper focuses on the development of a technological challenges of manufacturing the planar ceramic vacuum sensor based on the principles of hot-cathode ionization in the Bayard-Alpert configuration. The goal is to simplify the technological process by utilizing planar platinum structures with gold electrical paths instead of 3-dimensional structures. Various methods were tested, including the use of carbon-based SVM (Sacrifice Volume Materials) materials, but without success. Wet-etching using potassium hydroxide on Al2O3 substrates showed promise results. The findings highlight the challenges and progress made in developing the thermo-emittercomponent of the vacuum sensor.

Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology

Materials Science-Poland

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

This paper focuses on the development of a technological challenges of manufacturing the planar ceramic vacuum sensor based on the principles of hot-cathode...

Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology

Data publikacji: 22 maj 2024

Zakres stron: 126 - 139

Otrzymano: 05 lut 2024

Przyjęty: 11 kwi 2024

DOI: https://doi.org/10.2478/msp-2024-0007

Słowa kluczowe
alundum, wet etching, vacuum gauge, SVM, thick-film

© 2024 Laura Jasińska et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Technological challenges in manufacturing of vacuum gauge thermionic cathode using thick-film technology

Data publikacji: 22 maj 2024

Zakres stron: 126 - 139

Otrzymano: 05 lut 2024

Przyjęty: 11 kwi 2024

DOI: https://doi.org/10.2478/msp-2024-0007

Słowa kluczowealundum, wet etching, vacuum gauge, SVM, thick-film

© 2024 Laura Jasińska et al., published by Sciendo

This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Słowa kluczowe
alundum, wet etching, vacuum gauge, SVM, thick-film