[
Krane P., Gonzalez C.D., Lozano F., Paniagua G., Marconnet A., Sensitivity coefficient-based inverse heat conduction method for identifying hot spots in electronics packages: A comparison of grid-refinement methods, J. Electron. Packag. Trans. ASME, 2022, 144, 011008.
]Search in Google Scholar
[
Moore A.L., Shi L., Emerging challenges and materials for thermal management of electronics, Mater. Today, 2014, 17, 163-174.
]Search in Google Scholar
[
Rajput R.K., Engineering Thermodynamics, Third Edition, New Delphi: Laxmi Publications Ltd., 2007.
]Search in Google Scholar
[
Rajput R.K., A Textbook of Heat and Mass Transfer. New Delphi: S. Chand & Company Ltd., 2012.
]Search in Google Scholar
[
Toprak B.İ., Oskouei S.B., Bayer Ö., Solmaz İ., Experimental and numerical investigation of a novel pipe-network mini channel heatsink, Int. Commun. Heat Mass Transf, 2022, 136, 106212.
]Search in Google Scholar