[Wegman R., Tullos T. R.: Handbook of Adhesive Bonded Structural Repair, Noyes Publications, 1992.]Search in Google Scholar
[Täljsten B.: The Importance of Adhesive Bonding-An histiroci overview and future possibilities, Proceedings of the International Symposium on Bond Behaviour of FRP in Structures, ed. Chen and Teng, International Institute for FRP in Construction, 2005.]Search in Google Scholar
[Licari J. J., Swanson D. W.: Adhesive Technology for electronic applications, William Andrew Publishing, 2005.10.1016/B978-081551513-5.50007-3]Search in Google Scholar
[Rider A. N., Olsson-Jacques C. L., Arnott D. R.: Influence of Adherend Surface Preparation on Bond Durability, Surf. Interface Anal. 27, pp. 1055-1063, 1999.]Search in Google Scholar
[Critchlow G., Brewis D. M.: Review of surface pretreatments for aluminium alloys, J. Adhesion and Adhesives, 16, pp. 255-275, 1996.10.1016/S0143-7496(96)00014-0]Search in Google Scholar
[Irfan M. H.: Chemistry and Technology of Thermosetting Polymers in Construction Applications, Kluwer Academic Publishers, 1998.10.1007/978-94-011-4954-9]Search in Google Scholar
[Jin F. L., Park S. J.: Improvement in fracture behaviors of epoxy resins toughened with sulfonated poly(ether sulfone), Polymer Degradation and Stability, pp. 509-514, 2007.10.1016/j.polymdegradstab.2006.04.007]Search in Google Scholar
[Aymerich F., Lecca G., Priolo P.: Modelling of delamination growth in composite laminates by the virtual internal bond method, Composites: Part A 39 pp. 145-153, 2008.10.1016/j.compositesa.2007.11.012]Search in Google Scholar
[Dillarad D. A.: Adhesion Science and Engineering, A. V. Pocius [ed.], Eslevier Science, pp. 1-45, 2002.]Search in Google Scholar
[Bujanda A., Copeland C., Dibelka J., Forster A., Holmes L., Jensen R., Kosik W., McKnight S., Koellhoffer S., Gillespie Jr. J.: Analysis of Adhesively Bonded Ceramics Using an Asymmetric Wedge Test, ARL-TR-4665, 2008.]Search in Google Scholar
[Goland M., Reissner E.: The stresses in cemented joints, J. Appl. Mech., Trans. ASME, 66, A17-A27, 1944.10.1115/1.4009336]Search in Google Scholar
[Carpenter W. C.: Stresses in bonded connections using finite elements, Int. J. Numer. Methods Engng., 15, pp. 1659-1680, 1980.10.1002/nme.1620151108]Search in Google Scholar
[Budzik M., Jumel J., Imielinska K., Shanahan M. E. R.: Accurate and continuous adhesive fracture energy determination using an instrumented wedge test, International Journal of Adhesion and Adhesives 29, pp. 694-701, 2009.10.1016/j.ijadhadh.2008.11.003]Search in Google Scholar
[Griffith A. A.: The phenomena of rupture and flow in solids, Philosophical Transactions of the Royal Society of London, A 221, pp. 163-198, 1922.10.1098/rsta.1921.0006]Search in Google Scholar
[Irwin G.: Analysis of stresses and strains near the end of a crack traversing a plate, Journal of Applied Mechanics 24, pp. 361-364, 1957.10.1115/1.4011547]Search in Google Scholar
[Aglan H, Abdo Z.: An innovative approach to fatigue disbond propagation in adhesive joints, J Adhes Sci Technol, 10, pp. 183-98, 1998.10.1163/156856196X00346]Search in Google Scholar
[Sener J.-Y., Ferracin T.; Caussin L., Delannay F.: On the precision of the wedge-opened double cantilever beam method for measuring the debonding toughness of adhesively bonded plates, International Journal of Adhesion and Adhesives, Volume 22, Number 2, pp. 129-137, 2002.10.1016/S0143-7496(01)00046-X]Search in Google Scholar