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Microstructure refinement mechanism of undercooled Cu55Ni45 alloys

Hongfu Wang

Hongfu Wang

School of Mechanical Engineering, North University of ChinaTaiyuan, China
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Wang, Hongfu
, 
Cheng Tang

Cheng Tang

School of Mechanical Engineering, North University of ChinaTaiyuan, China
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Tang, Cheng
, 
Hongen An

Hongen An

Faculty of Engineering, University Malaysia SabahKota Kinabalu, Malaysia
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An, Hongen
 et 
Yuhong Zhao

Yuhong Zhao

College of Materials Science and Engineering, North University of ChinaTaiyuan, China
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Zhao, Yuhong
  
07 déc. 2021
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Publié en ligne: 07 déc. 2021
Pages: 319 - 330
Reçu: 28 juin 2021
Accepté: 16 sept. 2021
DOI: https://doi.org/10.2478/msp-2021-0027
Mots clés
© 2021 Hongfu Wang et al., published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International License.

Fig. 1

Schematic diagram of undercooling experimental device.
Schematic diagram of undercooling experimental device.

Fig. 2

Microstructure of Cu55Ni45 alloy under different undercooling degrees. [(A) ΔT = 47 K, (B) ΔT = 68 K, (C) ΔT = 70 K, (D) ΔT = 91 K, (E) ΔT = 187 K, (F) ΔT = 227 K, (G) ΔT = 272 K, (H) ΔT = 284 K].
Microstructure of Cu55Ni45 alloy under different undercooling degrees. [(A) ΔT = 47 K, (B) ΔT = 68 K, (C) ΔT = 70 K, (D) ΔT = 91 K, (E) ΔT = 187 K, (F) ΔT = 227 K, (G) ΔT = 272 K, (H) ΔT = 284 K].

Fig. 3

Solidification recalescence curve of Cu55Ni45 alloy.
Solidification recalescence curve of Cu55Ni45 alloy.

Fig. 4

EBSD characterization of Cu55Ni45 alloy with undercooling of 70 K. (A) Grain boundary diagram of microstructure of 70 K undercooling alloy, (B) grain boundary orientation diagram, (C) pole diagram of (B, D). distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.
EBSD characterization of Cu55Ni45 alloy with undercooling of 70 K. (A) Grain boundary diagram of microstructure of 70 K undercooling alloy, (B) grain boundary orientation diagram, (C) pole diagram of (B, D). distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.

Fig. 5

The relationship between dimensionless dendrite remelting fraction and undercooling of Cu55Ni45 alloy.
The relationship between dimensionless dendrite remelting fraction and undercooling of Cu55Ni45 alloy.

Fig. 6

EBSD characterization of Cu55Ni45 alloy with undercooling of 272 K. (A) Grain boundary diagram of microstructure of 272 K undercooling alloy, (B) grain boundary orientation diagram, (C). pole diagram of (B, D). Distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.
EBSD characterization of Cu55Ni45 alloy with undercooling of 272 K. (A) Grain boundary diagram of microstructure of 272 K undercooling alloy, (B) grain boundary orientation diagram, (C). pole diagram of (B, D). Distribution diagram of grain boundary orientation difference of (B). EBSD, electron backscatter diffraction.

Fig. 7

(A) Relationship between stress accumulation and initial undercooling during rapid solidification of Cu55Ni45alloy, (B) Microstructure of Cu55Ni45 alloy at ΔT = 187 K, (C) microstructure of Cu55Ni45 alloy at ΔT = 227 K.
(A) Relationship between stress accumulation and initial undercooling during rapid solidification of Cu55Ni45alloy, (B) Microstructure of Cu55Ni45 alloy at ΔT = 187 K, (C) microstructure of Cu55Ni45 alloy at ΔT = 227 K.

Fig. 8

(A) Evolution of average grain size and undercooling of Cu55Ni45 alloy, (B) evolution of microhardness and undercooling of Cu55Ni45 alloy.
(A) Evolution of average grain size and undercooling of Cu55Ni45 alloy, (B) evolution of microhardness and undercooling of Cu55Ni45 alloy.
Langue:
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Sciences des matériaux, Sciences des matériaux, autres, Nanomatériaux, Matériaux fonctionnels et intelligents, Caractérisation et propriétés des matériaux
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